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Your search returned 20 records. Click on the hyperlinks to view further details of Titles.. |
Magazine Name : Ieee Transactions On Components And Packaging Technologies
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Year : 2004 Volume number : 27 Issue: 03 |
Thermal Management Using Synthetic Jet Ejectors
(Article)
Subject:
Active Heat Sink
,
Channel Cooling
,
Synthetic Jets
Author:
Nicolas
Rumigny
Ari
Glezer
page:
439
-
444
Esd Protection Design To Overcome Internal Damage On Interface Circuits Of A Cmos Ic With Multiple Separated Power Pins
(Article)
Subject:
Electrostatic Discharge (Esd)
,
Esd Protection Circuit
,
Internal Bond
Author:
Ming-Dou
Ker
Chyh-Yih
Chang
Yi-Shu
Chang
page:
445
-
451
Investigation On Device Characteristic Of Mosfet Transistor Placed Under Bond Pad For High Pin Count Soc Applications
(Article)
Subject:
Bond Properties
,
Leakage Current
,
Temperature Cycling
Author:
Ming-Dou
Ker
Jeng-Jie
Peng
page:
452
-
460
Flip Chip On Board Assessment Of Reliability In Cellular Phone Application
(Article)
Subject:
Ball Grid Array
,
Chip Seal
,
Printed Circuit Board
Author:
Markku
Sillanpaa
Juscelino Hozumi
Okura
page:
461
-
467
A Device Transfer Process Selectively Occupied Repeated Transfer Sort For Resource Saving Integration Of Polymer Micro Optics Fabricated By Built In Mask Method
(Article)
Subject:
Resource Scheduling
,
Built-In-Self-Test
,
Multichip Module
Author:
Hana
Yoshimura
Yukihiko
Arai
Kunihiko
Asama
page:
468
-
471
A Study Of Electromigration In 3-D Flip Chip Solder Joint Using Numerical Simulation Of Heat Flux And Current Density
(Article)
Subject:
Computation Fluid Dynamics
,
Current Density
,
Flip-Chip
Author:
Tien-Yu
Lee
Taek Jung
Lee
King-Ning
Tu
page:
472
-
479
Multiobjective Placement Of Electronic Components Using Evolutionary Algorithms
(Article)
Subject:
Evolutionary Algorithms
,
Very Large Antennas Arrays
,
Wire-Lenght
Author:
Kalyanmoy
Deb
Prateek
Jain
page:
480
-
492
Fill Pattern And Particle Distribution Of Underfill Material
(Article)
Subject:
Coefficient Of Thermal Expansion (Cte)
,
Underfill Processing
Author:
L. D
Huang
Yue
Huang
Michael G. Pecht
Fellow
page:
493
-
498
Characterization Of Hygroscopic Swelling Behavior Of Mold Compounds And Plastic Packages
(Article)
Subject:
Mold Compounds
,
Chip/Mold Compound Interface
,
Humidity
Author:
Eric
Stellrecht
Bongtae
Han
Michael G.
Pecht
page:
499
-
506
St
(Article)
Subject:
Author:
page:
507
-
512
Simulation And Design For A Tunable Dispersion Compensator Package
(Article)
Subject:
Thermally Tunable
,
Numerical Simulation
,
Dispersion Compensation
Author:
Weidong
Zhu
Giovanni
Barbarossa
page:
513
-
522
The Influence Of Various Common Assumptions On The Boundary Condition Independence Of Compact Thermal Models
(Article)
Subject:
Boundary Condition And Clearance
,
Compact Tension Specimen
Author:
C. J. M.
Lasance
page:
523
-
529
Thermal Transient Modeling And Experimental Validation In The European Project Profit
(Article)
Subject:
Compact Thermal Model
,
Dual Cold Plte
,
Transient Thermal Modelling
Author:
Heinz
Pape
I
Schweitzer
page:
530
-
538
Optimal Design Methodlolgy Of Plate-Fine Heat Sinks For Electronic Cooling Using Using Entropy Generation Strategy
(Article)
Subject:
Engineering Design
,
Entropy Generation
,
Heat Transfer
Author:
C. J.
Shih
G. C.
Liu
page:
551
-
559
Mechanicbased Solution To Rf Mems Switch Stictch Stiction Problem
(Article)
Subject:
Actuation Voltage
,
Reliability
,
Switch
Author:
P. E.
Mercado
Tien-Yu Tom
Lee
page:
560
-
54
An Analysis Of Two-Heater Active Thermal Control Technology Fo Device Testing
(Article)
Subject:
Active Thermography
,
Thermal Testing
,
Heat Transfer
,
Maximum Density
Author:
J. W.
Wan
W. J.
Zhang
David
Torvi
page:
577
-
584
Model For Bga And Csp Relibility In Automotive Underhood Applications
(Article)
Subject:
Ball Grid Array
,
Bismaleimide
,
Plastic Ball Grid Array
Author:
Pradeep
Lall
Mohd Nokibul
Islam
Robert
Darveaux
page:
585
-
593
Full-Field Wafer Level Thin Film Stress Measurement By Phase-Stepping Shadow Moire
(Article)
Subject:
Phase Stepping
,
Thin Films
,
Wafer
Author:
Kuo-Shen
Chen
I-Kuan
Lin
Chia-Cheng
Chuang
page:
594
-
601
Arrhenius Average Temperature The Effective Temperature For Non-Fatigue Wearout And Long Term Reliability In Variable Thermal Conditions And Climates
(Article)
Subject:
Arrhenius
,
Thermal Factors
,
Thermal Applications
Author:
Michal
Tencer
John Seaborn
Moss
Trevor
Zapach
page:
602
-
607
Effects Of Silica Filler And Diuent On Material Properties And Reliability Of Nonconductive Pastes (Ncps) For Flip-Chip Applications
(Article)
Subject:
Diluent
,
Filler Size
,
Thermal Cycle Stability
,
Flip-Chip
Author:
Kyung-Woon
Jang
Woon-Seong
Kwon
page:
608
-
615
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